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INTEGRATED CIRCUITS
74ALVCH16952 16-bit registered transceiver (3-State)
Preliminary specification Supersedes data of 1994 Jul IC24 Data Handbook 1998 Sep 01
Philips Semiconductors
Philips Semiconductors
Preliminary specification
16-bit registered transceiver (3-State)
74ALVCH16952
FEATURES
* Complies with JEDEC standard no. 8-1A * CMOS low power consumption * MULTIBYTETM flow-through pin-out architecture * Low inductance, multiple center power and ground pins for
minimum noise and ground bounce
DESCRIPTION
The 74ALVCH16952 consists of two sections, each containing a dual octal non-inverting registered transceiver. Two 8-bit back to back registers store data flowing in both directions between two bi-directional busses. Data applied to the inputs is entered and stored on the rising edge of the clock (CPXX, where X is AB or BA) provided that the clock enable (CEXX) is LOW. The data is then present at the 3-State output buffers, but is only accessible when the output enable input (OEXX) is LOW. Data flow from A inputs to B outputs is the same as for B inputs to A outputs.
* Direct interface with TTL levels * Output drive capability 50 transmission lines @ 85C
QUICK REFERENCE DATA
GND = 0V; Tamb = 25C; tr = tf = 2.5ns SYMBOL tPHL/tPLH fMAX CI CPD PARAMETER Propagation delay CPnn, to An, Bn Maximum clock frequency Input capacitance Power dissipation capacitance per buffer
CONDITIONS VCC = 3.3V, CL = 50pF VCC = 2 5V CL = 30pF 2.5V,
TYPICAL 3.2 350 3.0
UNIT ns MHz pF pF
VI = GND to VCC1
30
NOTES: 1. CPD is used to determine the dynamic power dissipation (PD in W): PD = CPD x VCC2 x fi + S (CL x VCC2 x fo) where: fi = input frequency in MHz; CL = output load capacity in pF; fo = output frequency in MHz; VCC = supply voltage in V; S (CL x VCC2 x fo) = sum of outputs.
ORDERING INFORMATION
PACKAGES 56-Pin Plastic TSSOP Type II TEMPERATURE RANGE -40C to +85C OUTSIDE NORTH AMERICA 74ALVCH16952 DGG NORTH AMERICA ACH16952 DGG DWG NUMBER SOT364-1
FUNCTION TABLE for register An or Bn
INPUTS An or Bn X L H CPXX X CEXX H L L INTERNAL Q NC L H OPERATING MODE Hold data Load data Load data
FUNCTION TABLE for output enable
INPUTS OEnn H L L INTERNAL Q X L H An or Bn OUTPUTS Z L H OPERATING MODE Disable outputs Enable outputs Enable outputs
H = HIGH voltage level L = LOW voltage level = LOW-to-HIGH transition
NC = no change X = don't care Z = high impedance OFF-state
1998 Sep 01
2
Philips Semiconductors
Preliminary specification
16-bit registered transceiver (3-State)
74ALVCH16952
PIN CONFIGURATION PIN DESCRIPTION
1OEAB 1CPAB 1CEAB GND 1A0 1A1 VCC 1A2 1A3 1A4 GND 1A5 1A6 1A7 2A0 2A1 2A2 GND 2A3 2A4 2A5 VCC 2A6 2A7 GND 2CEAB 2CPAB 2OEAB 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 56 55 54 53 52 51 50 49 48 47 46 45 44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 1OEBA 1CPBA 1CEBA GND 1B0 1B1 VCC 1B2 1B3 1B4 GND 1B5 1B6 1B7 2B0 2B1 2B2 GND 2B3 2B4 2B5 VCC 2B6 2B7 GND 2CEBA 2CPBA 2OEBA Data Input To internal circuit VCC
PIN NUMBER 1, 28 2, 27 3, 26 5, 6, 8, 9, 10, 12, 13, 14 4, 11, 18, 25, 32, 39, 46, 53 7, 22, 35, 50 15, 16, 17, 19, 20, 21, 23, 24 29, 56 30, 55 31, 54 42, 41, 40, 38, 37, 36, 34, 33 52, 51, 49, 48, 47, 45, 44, 43
SYMBOL nOEAB nCPAB nCEAB 1A0 to 1A7 GND VCC 2B0 to 2B7 nOEBA nCPBA nCEBA 2B0 to 2B7 1B0 to 1B7
NAME AND FUNCTION Output enable A-to-B Clock input A-to-B A-to-B enable Data inputs/outputs Ground (0V) Positive supply voltage Data inputs/outputs Output enable B-to-A Clock input B-to-A B-to-A enable Data inputs/outputs Data inputs/outputs
BUSHOLD CIRCUIT
SY00026
LOGIC SYMBOL
5 6 8 9 10 12 1A0 1A1 1B0 52 1B1 51 1B2 49 1B3 48 1B4 47 1B5 45 1B6 44 1B7 43 15 2A0 16 2A1 17 19 20 21 23 2A2 2A3 2A4 2A5 2A6 2B0 42 2B1 41 2B2 2B3 2B4 2B5 2B6 40 38 37 36 34
1A2 1A3 1A4 1A5 13 1A6 14 1A7 56 1OEBA 1 1OEAB 3 1CEAB 54 1CEBA 2 1CPAB 55 1CPBA
SW00050
24 2A7 29 2OEBA 28 2OEAB 26 2CEAB 31 2CEBA 27 2CPAB 30 2CPBA
2B7 33
SY00029
1998 Sep 01
3
Philips Semiconductors
Preliminary specification
16-bit registered transceiver (3-State)
74ALVCH16952
LOGIC SYMBOL (one section)
CEAB
CPAB
OEAB
CEBA
CPBA
OEBA
Q A0 D CP
Q D CP B0
8 IDENTICAL CHANNELS
TO 7 OTHER CHANNELS
SY00027
1998 Sep 01
4
Philips Semiconductors
Preliminary specification
16-bit registered transceiver (3-State)
74ALVCH16952
LOGIC SYMBOL (IEEE/IEC)
1OEBA 1CEBA 1CPBA 1OEAB 1CEAB 1CPAB 2OEBA 2CEBA 2CPBA 2OEAB 2CEAB 2CPAB 1A0 56 54 55 1 3 2 29 31 30 28 26 27 5 6D 1A1 1A2 1A3 1A4 1A5 1A6 1A7 2A0 6 8 9 10 12 13 14 15 9 12D 2A1 2A2 2A3 2A4 2A5 2A6 2A7 16 17 19 20 21 23 24 11D 10 41 40 38 37 36 34 33 2B1 2B2 2B3 2B4 2B5 2B6 2B7 1EN3 G1 1C5 EN4 G2 2C6 EN9 G7 7C11 EN10 G8 8C12 52 1B0
3 4
5D
51 49 48 47 45 44 43 42
1B1 1B2 1B3 1B4 1B5 1B6 1B7 2B0
SY000028
1998 Sep 01
5
Philips Semiconductors
Preliminary specification
16-bit registered transceiver (3-State)
74ALVCH16952
RECOMMENDED OPERATING CONDITIONS
LIMITS SYMBOL PARAMETER DC supply voltage 2.5V range (for max. speed performance @ 30 pF output load) VCC DC supply voltage 3.3V range (for max. speed performance @ 50 pF output load) DC Input voltage range DC output voltage range Operating free-air temperature range Input rise and fall times VCC = 2.3 to 3.0V VCC = 3.0 to 3.6V CONDITIONS MIN 2.3 3.0 0 0 -40 0 0 MAX 2.7 V 3.6 VCC VCC +85 20 10 V V C ns/V UNIT
VI VO Tamb tr, tf
ABSOLUTE MAXIMUM RATINGS
In accordance with the Absolute Maximum Rating System (IEC 134) Voltages are referenced to GND (ground = 0V) SYMBOL VCC IIK VI IOK VO IO IGND, ICC Tstg PTOT PARAMETER DC supply voltage DC input diode current DC in ut voltage input DC output diode current DC output voltage DC output source or sink current DC VCC or GND current Storage temperature range Power dissipation per package -plastic medium-shrink (SSOP) -plastic thin-medium-shrink (TSSOP) For temperature range: -40 to +125 C above +55C derate linearly with 11.3 mW/K above +55C derate linearly with 8 mW/K VI t0 For control pins1 For data inputs1 VO uVCC or VO t 0 Note 1 VO = 0 to VCC CONDITIONS RATING -0.5 to +4.6 -50 -0.5 to +4.6 -0.5 to VCC +0.5 "50 -0.5 to VCC +0.5 "50 "100 -65 to +150 850 600 V mA V mA mA C mW UNIT V mA
NOTE: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
1998 Sep 01
6
Philips Semiconductors
Preliminary specification
16-bit registered transceiver (3-State)
74ALVCH16952
DC ELECTRICAL CHARACTERISTICS
Over recommended operating conditions. Voltage are referenced to GND (ground = 0 V). LIMITS SYMBOL PARAMETER TEST CONDITIONS Temp = -40C to +85C MIN VIH HIGH level Input voltage VCC = 2.3 to 2.7V VCC = 2.7 to 3.6V LOW level Input voltage VCC = 2.3 to 2.7V VCC = 2.7 to 3.6V VCC = 2 3 to 3 6V; VI = VIH or VIL; IO = -100A 100A 2.3 3.6V; VCC = 2.3V; VI = VIH or VIL; IO = -6mA VO OH HIGH level output voltage VCC = 2.3V; VI = VIH or VIL; IO = -12mA VCC = 2.7V; VI = VIH or VIL; IO = -12mA VCC = 3.0V; VI = VIH or VIL; IO = -12mA VCC = 3.0V; VI = VIH or VIL; IO = -24mA VCC = 2 3 to 3 6V; VI = VIH or VIL; IO = 100A 2.3 3.6V; VCC = 2.3V; VI = VIH or VIL; IO = 6mA VOL LOW level output voltage VCC = 2.3V; VI = VIH or VIL; IO = 12mA VCC = 2.7V; VI = VIH or VIL; IO = 12mA VCC = 3.0V; VI = VIH or VIL; IO = 24mA II IOZ ICC ICC IBHL Input leakage current g 3-State output OFF-state current Quiescent supply current Additional quiescent supply current Bus hold LOW sustaining current VCC = 2 3 to 3 6V; 2.3 3.6V; VI = VCC or GND VCC = 2.7 to 3.6V; VI = VIH or VIL; VO = VCC or GND VCC = 2.3 to 3.6V; VI = VCC or GND; IO = 0 VCC = 2.3V to 3.6V; VI = VCC - 0.6V; IO = 0 VCC = 2.3V; VI = 0.7V2 VCC = 3.0V; VI = Bus hold HIGH sustaining current Bus hold LOW overdrive current Bus hold HIGH overdrive current 0.8V2 45 75 -45 -75 500 -500 -175 VCC*0.2 02 VCC*0.3 VCC*0.6 VCC*0.5 VCC*0.6 VCC*1.0 1.7 2.0 TYP1 1.2 V 1.5 1.2 1.5 VCC VCC*0.08 VCC*0.26 VCC*0.14 VCC*0.09 VCC*0.28 GND 0.07 0.15 0.14 0.27 0.1 0.1 0.2 150 - 150 0.20 0 20 0.40 0.70 0.40 0.55 5 10 40 750 A A A A A V V V V 0.7 V 0.8 MAX UNIT
VIL
IBHH IBHLO IBHHO
VCC = 2.3V; VI = 1.7V2 VCC = 3.0V; VI = VCC = 3.6V2 VCC = 3.6V2 2.0V2
A A A
NOTES: 1. All typical values are at Tamb = 25C. 2. Valid for data inputs of bus hold parts.
1998 Sep 01
7
Philips Semiconductors
Preliminary specification
16-bit registered transceiver (3-State)
74ALVCH16952
AC CHARACTERISTICS FOR VCC = 2.3V TO 2.7V RANGE
GND = 0V; tr = tf 2.0ns; CL = 30pF SYMBOL LIMITS PARAMETER Propagation delay nCPAB to nBn, nCPBA to nAn 3-State output enable time nOE to nAn, nBn 3-State output disable time nOE to nAn, nBn Pulse width HIGH or LOW nCPAB, nCPBA Set up time An or Bn before CPAB Set up time CEAB or CEBA before CPAB Hold time An or Bn after CPAB Hold time An or Bn after CPAB WAVEFORM MIN tPLH/tPHL tPZH/tPZL tPHZ/tPLZ tW 3 4 4 3 3 3 3 3 3 1.0 1.0 1.0 3.3 1.7 ns 1.2 0.6 ns 1.1 150 MHz VCC = 2.5V 0.2V TYP MAX 4.1 5.4 5.3 ns ns ns ns UNIT
tSU
th
Fmax Maximum clock pulse frequency NOTE: 1. All typical values are at VCC = 2.5V and Tamb = 25C.
AC CHARACTERISTICS FOR VCC = 3.0V TO 3.6V RANGE AND VCC = 2.7V
GND = 0V; tr = tf = 2.5ns; CL = 50pF LIMITS SYMBOL PARAMETER Propagation delay nCPAB to nBn, nCPBA to nAn 3-State output enable time nOE to nAn, nBn 3-State output disable time nOE to nAn, nBn Pulse width HIGH or LOW nCPAB, nCPBA Set up time An or Bn before CPAB Set up time CEAB or CEBA before CPAB Hold time An or Bn after CPAB Hold time An or Bn after CPAB WAVEFORM VCC = 3.3V 0.3V MIN tPHL/tPLH tPZH/tPZL tPHZ/tPLZ tW 1, 4 2, 4 2, 4 3, 4 3, 4 3, 4 3, 4 3, 4 1, 4 1.0 1.0 1.1 3.3 1.5 1 0.8 1.1 150 TYP1, 2 MAX 3.9 4.4 4 MIN 1.0 1.0 1.4 3.3 1.9 ns 1 0.6 ns 0.9 150 MHz VCC = 2.7V TYP1 MAX 4.6 5.3 4.4 ns ns ns ns UNIT
tSU
th
Fmax Maximum clock pulse frequency NOTES: 1. All typical values are at Tamb = 25C. 2. VCC = 3.3V
1998 Sep 01
8
Philips Semiconductors
Preliminary specification
16-bit registered transceiver (3-State)
74ALVCH16952
AC WAVEFORMS
VCC = 2.3 TO 2.7 V RANGE 1. VM = 0.5 V 2. VX = VOL + 0.15V 3. VY = VOH - 0.15V 4. VI = VCC 5. VOL and VOH are the typical output voltage drop that occur with the output load. VCC = 3.0 TO 3.6 V RANGE AND VCC = 2.7 V 1. VM = 1.5 V 2. VX = VOL + 0.3V 3. VY = VOH - 0.3V 4. VI = 2.7 V 5. VOL and VOH are the typical output voltage drop that occur with the output load.
2.7V CPXX INPUT 1/fmax VOH VM OUTPUT HIGH-to-OFF OFF-to-HIGH tW tPHL tPLH GND outputs enabled outputs disabled outputs enabled VY VM 2.7V OEXX INPUT GND VM
tPLZ VCC OUTPUT LOW-to-OFF OFF-to-LOW VOL tPHZ
tPZL
VM VX
tPZH
GND VOH An, Bn OUTPUT VOL
VM
SY00032
Waveform 3. 3-State enable and disable times
SY00030
TEST CIRCUIT
VCC S1 2Waveform 1. Clock input (CPBA, CPAB) to output (Bn, An) propagation delays, the clock pulse width and the maximum clock pulse frequency.
2.7V CPXX INPUT
GND NOTE: The shaded areas indicate when the input is permitted to change for predictable output performance.
Waveform 2. Set-up and hold times for the An, Bn and CEXX inputs.
1998 Sep 01
EEE E EEEEEEEEE EEE E EEEEEEEEE EEE EEEEEEE EEE
VM th th tSU tSU VM
2.7V An, Bn CEnn INPUT GND
Test Circuit for 3-State Outputs SWITCH POSITION TEST tPLH/tPHL tPLZ/tPZL tPHZ/tPZH SWITCH Open 2SY00031
DEFINITIONS RL = Load resistor CL = Load capacitance includes jig and probe capacitance RT = Termination resistance should be equal to ZOUT of pulse generators.
SW00047
Load circuitry for switching times
9
Philips Semiconductors
Preliminary specification
16-bit registered transceiver (3-State)
74ALVCH16952
TSSOP56: plastic thin shrink small outline package; 56 leads; body width 6.1mm
SOT364-1
1998 Sep 01
10
Philips Semiconductors
Preliminary specification
16-bit registered transceiver (3-State)
74ALVCH16952
NOTES
1998 Sep 01
11
Philips Semiconductors
Preliminary specification
16-bit registered transceiver (3-State)
74ALVCH16952
DEFINITIONS
Data Sheet Identification
Objective Specification
Product Status
Formative or in Design
Definition
This data sheet contains the design target or goal specifications for product development. Specifications may change in any manner without notice. This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product. This data sheet contains Final Specifications. Philips Semiconductors reserves the right to make changes at any time without notice, in order to improve design and supply the best possible product.
Preliminary Specification
Preproduction Product
Product Specification
Full Production
Philips Semiconductors and Philips Electronics North America Corporation reserve the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. LIFE SUPPORT APPLICATIONS Philips Semiconductors and Philips Electronics North America Corporation Products are not designed for use in life support appliances, devices, or systems where malfunction of a Philips Semiconductors and Philips Electronics North America Corporation Product can reasonably be expected to result in a personal injury. Philips Semiconductors and Philips Electronics North America Corporation customers using or selling Philips Semiconductors and Philips Electronics North America Corporation Products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors and Philips Electronics North America Corporation for any damages resulting from such improper use or sale. Philips Semiconductors 811 East Arques Avenue P.O. Box 3409 Sunnyvale, California 94088-3409 Telephone 800-234-7381 (c) Copyright Philips Electronics North America Corporation 1998 All rights reserved. Printed in U.S.A. Date of release: 06-98 Document order number: 9397-750-04563
Philips Semiconductors
1998 Sep 01 12

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